Description
UNPARALLELED PERFORMANCE
With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming.
8+2+1 Phases Hybrid Digital VRM Design
– 8+2+1 Phases Low RDS(on) MOSFETs
– Premium Choke and Capacitors to improve transient response and minimize oscillation
GIGABYTE B760 Motherboards
are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.
Specifications |
|
SKU | B760-DS3H |
Specifications | SOCKET LGA 1700 CHIPSET MEMORY MODULE MEMORY SLOT MEMORY ARCH STORAGE FORM FACTORY |
Brand | GIGABYTE |
Weight | 1.280000 |
Chipset Brand | Intel B760 |
Socket | Intel LGA 1700 |
Form Factor | ATX |
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