The Speedster series exemplifies a modern aerodynamic style though clean and elegant design. It is a thoughtful design with the sole purpose of maximizing airflow to improve cooling and performance.
AIRFLOW AND ASTHETICS
With each iteration of the XFX Merc series, we have simplified the design while improving performance. This newest iteration introduces our all new ridged backplate design which increases the overall surface area by 33% resulting in increased in heat dissipation when paired with thermal pads.
XFX GHOST THERMAL
Our new design features a stright through airflow venting to significatly improves cooling and compliments open design of the Ghost Thermal floating shroud design along with numerous other cooling features.
The XFX 7900 Series brings back the vapor chamber design, a more efficient method for heat dissipation than traditional cold plates alone. The vapor chamber can quickly quickly and efficiently transfer heat from the GPU and VRAM to the heat pipes, and then into the heatsink assembly.
|Specifications||Bus Type: PCI-E 4.0
Stream Processors: 6144
|Memory Size||24 GB|
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